Chun Hsiung Lin

Tele: +886-3-5712121#55918
Office: ES601
Lab Website


1995 – 2000
Ph.D, Materials Science & Engineering, University of Illinois at Urbana-Champaign
1993 – 1995
M.S., Materials Science & Engineering, Rutgers University
1986 – 1990
B.S., Materials Science & Engineering, National Tsing-Hua University, Taiwan


Work Experience
2019.03 – Present
Professor in International College of Semiconductor Technology National Chiao Tung University, Hsinchu, Taiwan
2012.02 – 2019.03
Manager, Taiwan Semiconductor Manufacturing Company (TSMC). Hsinchu, Taiwan
2006.03 – 2012.01
Staff Engineer, Northrop Grumman Aerospace System. Redondo Beach, CA, USA
2001.02 – 2006.02
R&D Engineer, Wireless Semiconductor Division, Agilent Technologies Inc., Santa Clara, CA and Fort Collins, CO, USA (i.e. Avago Technologies/now Broadcom)
2000.03 – 2001.01
Sr. Process Engineer, Portland Technology Development, Intel Corporation, OR, USA


Research Area
  • Advanced III-V compound semiconductor and Si CMOS Devices
  • Compound semiconductor device manufacturing and integration (GaAs, InP, Sb-based and GaN)
  • Semiconductor process technology of advanced 3D Si CMOS devices (e.g. FinFET)