Assistant Professor
Tele: +886-3-5712121 #55930
Office: EF R465
E-mail: chench@nycu.edu.tw
Lab Website
Tele: +886-3-5712121 #55930
Office: EF R465
E-mail: chench@nycu.edu.tw
Lab Website
Education
2015-2020
Ph. D. Department of Materials Science and Engineering, National Taiwan University
2013-2015
M.S. Department of Materials Science and Engineering, National Taiwan University
2008-2013
B.S. Department of Materials Science and Engineering, National Cheng Kung University
Work Experience
2023 – Present
Assistant Professor, International College of Semiconductor Technology, NYCU
2021 – 2023
Researcher, Fraunhofer Institute for Reliability and Microintegration IZM
2019 – 2021
Guest Researcher, Fraunhofer Institute for Reliability and Microintegration IZM
Research Area
- Electronic Packaging for Micro- & Power Electronic Packaging –Interconnection Technology
- Reliability tests for Electronic Packaging – Passive Tests and Active Power Cycling
- Interfacial Reaction (Similar/Dissimilar metallic bonding)
- Materials Fractography and Failure Analysis
Honors & Awards
2020
Postdoctoral Research Abroad Program (MOST)
2019
DAAD Research Grants – Short-Term Grants
2019
Graduate Students Study Abroad Program (MOST)